WO2014041245A1

WO2014041245A1 - Electronic device with housing-integrated functionalities and method therefor

Info

Publication number: WO2014041245A1
Application number: PCT/FI2013/050878
Authority: WO
Inventors: Antti KERÄNEN; Mikko Heikkinen; Juha Salo
Original assignee: Tactotek Oy
Priority date: 2012-09-12
Filing date: 2013-09-12
Publication date: 2014-03-20
Also published as: GB2505878A; GB201216216D0

Abstract

An electronic device comprising a housing, such as a cover, comprising housing material molded so as to at least partially embed a plurality of functional elements (106a, 106b, 106c, 106d) associated with at least two different functionalities in said housing material, wherein a first element (106a) of said plurality comprises a number of user touch-based control input sensing components capable of receiving user touch-based control input for user input acquisition and a second element (106b) of said plurality comprises e.g. a number of tactile and/or vibration components configured to provide the electronic device with tactile/vibrating alarm or feedback functionality. A corresponding method of manufacture is presented.

Description

ELECTRONIC DEVICE WITH HOUSING-INTEGRATED FUNCTIONALITIES AND METHOD THEREFOR

FIELD OF THE INVENTION

Generally the present invention concerns electronic devices and related components. Particularly, however not exclusively, the invention pertains to touch Ul-provided electronic devices and integration of various elements therein.

BACKGROUND

User interfaces (UI) of electronic devices such as computers including desktop, laptop and palmtop devices have developed tremendously since the advent of the era of modern computing. Simple switches, buttons, and knobs have been in many cases replaced by keyboard, keypad, mouse, speech recognition input, touch display and related UI means like touch- pad. Such more modern UI alternatives can provide the users of the associated devices with somewhat bearable user experience after a typically extensive adoption period.

In particular, touch surfaces such as touch pads and touch screens undoubtedly form the 'de facto' UI of modern smartphones, tablets and supplementary UI of many desktop computers as well. The touch displays may generally apply of a number of different technologies for implementing the touch-sensitive functionality. Among various other potential options, e.g. capacitive, resistive, infrared, optical imaging (camera-based), FTIR (frustrated total internal reflection), acoustic, and hybrid solutions are feasible.

Many electronic devices, such as smart phones, containing a touch- sensitive surface are also capable of executing a load of other functionalities many of which can be provided through additional components arranged into the device. For example, vibration/tactile functions are often enabled by such dedicated components.

Loading an electronic device with various components has traditionally turned out difficult, i.e. space-consuming, weighty and expensive, which has set various limitations to the designers and manufacturers trying to produce top notch end products. Previous solutions for locating the necessary parts in electronic devices have generally performed poorly in view of integration and sometimes also functionality, as the components dis- posed deep within the device internals such as various circuit boards may have ultimately been too isolated from the environment of the device outside the housing to provide optimum level of interaction with the users, for example. Further, awkward solutions, such as intensive packaging or dampening elements, for protecting the potentially rather delicate elements from external shocks and e.g. weather conditions to prevent breakage have been often required.

SUMMARY OF THE INVENTION The objective of the embodiments of the present invention is to at least alleviate one or more of the aforesaid drawbacks evident in the prior art arrangements particularly in the context of force touch-based input arrangements. The objective is generally achieved with a device and a corresponding method of manufacture in accordance with the present invention.

The obtained device with housing-integrated functionalities may be utilized for simple buttons and 2D touch displays as well as for a technological implementation alternative to be exploited in connection with 3D gesture tracking and position tracking among other potential applications.

In accordance with one aspect of the present invention an electronic device comprises

-a housing, or a 'cover', comprising housing material molded so as to at least partially embed a plurality of functional elements associated with at least two different functionalities in said housing material, wherein

-a first element of said plurality comprises a number of user touch-based control input sensing components capable of receiving user touch-based control input for user input acquisition and -a second element of said plurality advantageously comprises a number of tactile and/or vibration components configured to provide the electronic device with tactile/vibrating alarm or feedback functionality. For instance, the embedded elements may be electronic, electro-optic, electroacoustic, piezoelectric, electric, and/or electromechanical by nature, or at least comprise such components.

Optionally the device may comprise a number of further elements with characterizing functionality or functionalities in said plurality.

In one embodiment, the touch-based control input sensing components comprise at least one component selected from the group consisting of: strain, resistive, capacitive and optical sensing component. The placing of the sensing components in the housing material may depend on the selected technology. Optical and strain sensing components such as light detectors, cameras (image sensors), and strain gauges may preferably be embedded in the housing material surrounding and/or underlying the touching area often constructed utilizing some optically sufficiently transparent material such as glass or plastic. Optical sensing components may, in addition to the aforesaid light/radiation-receiving components, be also supplemented with or considered to incorporate embedded light-emitting components such as (O)LEDs ((organic) light-emitting diode) configured to cooperate with the receivers to implement the touch sensing functionali- ty such as a free-space (optical grid on the display)-based touch screen or (F)TI -based touch screen. Resistive and capacitive sensing components may be utilized by embedding the sensing components within the touching area, for example. In one feasible embodiment the entire housing of the device may be molded as substantially one piece, optionally of optically sufficiently transparent material regarding the desired wavelengths, wherein the touch-sensing components, e.g. resistive or capacitive components, may be embedded.

In another, either supplementary or alternative, embodiments the tactile and/or vibration components configured to provide the electronic device with tactile/vibrating alarm or feedback functionality comprise at least one piezoelectric actuator or vibration motor. In further, either supplementary or alternative, embodiments multiple tactile and/or vibration components are configured in a predetermined, systematic, e.g. symmetric, formation. In further, either supplementary or alternative, embodiments tactile and/or vibration components are embedded in the housing material so as to enable functional linkage with the sensing components. Thus, spatially precise, input-location matching, tactile feedback may be arranged regarding touch input substantially in real-time. Further on, vibration applying func- tions may be executed in response to some device-specific action such as incoming communication, e.g. a phone call or SMS (Short Message Service).

In further, either supplementary or alternative embodiments, additional el- ements and related functionalities may be embedded in the housing material. E.g. additional optical sensing components such as photodiodes or image sensors applicable in Ambient Light Sensing and/or Proximity Sensing components may be embedded. Ambient light sensing may be utilized for automatically regulating the screen brightness on basis of the ob- servations of the ambient lighting and proximity sensing (e.g. infrared transmitter/receiver) may be utilized to detect the presence of nearby objects without any physical contact, for instance.

Various other elements may also either alternatively or additionally be in- tegrated into the housing. Elements such microphones, communication chips (e.g. wireless transceiver such as Bluetooth chip or a radio frequency identification/near field communication tag or transceiver), wired communication interfaces, memory and/or device control parts such as a processing unit may be embedded therein.

In further, either supplementary or alternative, embodiments one or more embedded elements are provided on a base material (substrate) e.g. before or during embedding in the housing material. The base material may be a flexible substrate optionally comprising plastics, silicon, rubber, or a mix- ture of these. The base material may be a thin underlay such as a film or sheet. The base may consist of one unitary piece or several pieces brought together before or during the molding process. The base material may be configured to provide electric conductivity within the base material and/or providing electricity from and/or to other parts in the electronic device. Therefore, the base material may contain a number of recesses, cavities, or holes for accommodating electronics such as electronic circuits, conductors, etc. Further, the electronics may be provided on the substrate, e.g. by utilizing a selected printing technique, or attached as readymade entities, e.g. SMT (surface-mount technology) and/or flip chip entities, to the substrate by e.g. glue or other adhesive.

In further, either supplementary or alternative, embodiments multiple tac- tile and/or vibration components are configured in a predetermined, systematic, e.g. symmetric, formation.

In further, either supplementary or alternative, embodiments the housing element is replaceable, e.g. a snap-fit housing with related features.

In another aspect, a housing as described herein for an electronic apparatus is provided.

In accordance with a further aspect of the present invention a method for manufacturing at least part of an electronic device's housing, comprises

-molding the housing material into a desired target shape so as to at least partially embed a plurality of functional elements associated with at least two different functionalities in said housing material, wherein

-a first element of said plurality comprising a number of user touch-based control input sensing components capable of receiving user touch-based control input for user input acquisition and -a second element (106b, 106c, 106d) of said plurality comprising a number of components configured to provide at least one function selected from the group consisting of: tactile feedback, haptic feedback, vibration, communication, sound output, sound input, data processing, data storage, proximity sensing, and ambient light sensing.

In further, either supplementary or alternative, embodiments the housing is manufactured by over- molding such as injection molding. The elements to be embedded in the housing material may be placed directly in the mold frame on preferred places or the elements may be provided first on a base component, which is then placed inside the mold frame. In various embodiments the elements may be provided partially on a base component and partially directly inside of the mold frame.

The previously presented considerations concerning the various embodiments of the electronic device may be flexibly applied to the embodiments of the related housing or method mutatis mutandis and vice versa, as being appreciated by a skilled person.

As briefly reviewed hereinbefore, the utility of the different aspects of the present invention arises from a plurality of issues depending on each particular embodiment. The manufacturing costs for producing the electronic device in accordance with the present invention to provide a plurality of different functionalities may be kept low due to rather extensive use of affordable and easily obtainable materials, elements, and process technology. The obtainable housing/electronic device is scalable from hand-held mobile devices and game consoles to larger applications. The feasible process technology also provides for rapid industrial scale manufacturing of the device in addition to mere prototyping scenarios.

The device may be kept thin, light, and energy conserving in order to suit most use scenarios with little modifications to the surrounding components and designs. The obtained integration level is high. The device struc- ture and embedded elements may be made robust towards external impacts considering the compact structure that is attained. This will offer better protection for the applied elements.

Yet, the housing structure suits particularly well various industrial applica- tions including e.g. industrial automation/electronics control apparatuses, as it may provide hermetical and dust repelling isolation from the hostile use environment with e.g. humid and/or dusty air.

Regarding the potential replaceability of the housing, preferably executa- ble without tools (e.g. snap-fit), a number of related benefits may be conceived. A housing of the device may be tailored for certain use and provided with related embedded functional elements. Upon new use or breakage, the cover may be flexibly changed to a new one with similar or dif- ferent functional elements embedded. All the possible elements do not have to be included in the same housing, which makes each individual housing simpler, lighter, smaller and also more affordable. Still, touch-based input may be cleverly linked with accurate, location- specific tactile, e.g. haptic, feedback by means of the present invention.

The expression "a number of may herein refer to any positive integer starting from one (1).

The expression "a plurality of may refer to any positive integer starting from two (2), respectively.

Different embodiments of the present invention are also disclosed in the attached dependent claims.

BRIEF DESCRIPTION OF THE RELATED DRAWINGS

Next, the embodiments of the present invention are more closely reviewed with reference to the attached drawings, wherein

Fig. 1 illustrates the concept of the base material with attached elements utilized in the present invention via one embodiment thereof.

Fig. 2 illustrates the overall concept of the present invention via one em- bodiment thereof.

Fig. 3 is a flow diagram disclosing an embodiment of a method in accordance with the present invention.

Fig. 4 is a block diagram of one embodiment of an apparatus comprising elements in accordance with the present invention.

DETAILED DESCRIPTION OF THE EMBODIMENTS

With reference to Figure 1, an axonometric view 102 of an embodiment of base element/base material 104, which may be utilized in the present invention, is shown. The electronic device and/or base material 104 may comprise various additional components, in addition to the disclosed ones. As being appreciated by skilled readers, also the configuration of the dis- closed components may differ from the explicitly depicted one depending on the requirements of each intended use scenario wherein the present invention may be capitalized. The base material 104 may be used for providing a support surface for the required elements 106a, 106b, 106c, 106d to be attached/provided thereto, which will then facilitate embedding the elements further on in the device housing. The base material 104 may establish optionally flexible substrate, e.g. circuit board, optionally comprising plastics, silicon, rubber, or a mixture of these. The base material 104 may thus be a thin underlay such as a film or sheet. The base component 104 may consist of one unitary piece or several pieces brought together before or during the molding process. The base material 104 may be configured to provide electric conductivity within the base material 104 and/or providing electricity from and/or to other parts in the electronic device. Therefore, the base material 104 may contain a number of recesses, cavities, or holes for accommodating various light electronics such as electronic circuits, conductors, etc. in the substrate. Al- ternatively, the electronics may be provided on the substrate, e.g. by utilizing a selected printing technique, or attached as readymade entities, e.g. SMT (surface-mount technology) and/or flip chip entities, to the substrate by e.g. glue or other adhesive. In some embodiments, the base material 104 may comprise polyimide (PI). Polyimide may be utilized to construct flexible, preferably transparent, base elements, or 'substrates'.

In some embodiments, F -4 material may be utilized as base material 104. For example, a printed circuit board (PCB) may be formed.

The elements 106a, 106b, 106c, 106d comprise may touch sensing and tactile/vibrating alarm or feedback functionality providing components. Further, they may comprise e.g. sound input (microphone) devices, output devices (beeper/buzzer, loudspeaker), visible or non-visible lights (LEDs, etc.), ALS devices, PS devices, processing devices (microprocessor, microcontroller, digital signal processor (DSP)), and/or memory chips, or programmable logic chips in addition to various still unmentioned sensors. Indeed, a myriad of technologies may be implemented.

In the embodiment shown in Figure 1, wherein the base material 104 is designed to surround and thus define a touching area, the elements 106a, 106b, 106c, 106d comprising e.g. strain and/or optical sensing components may be utilized. The placing or number of elements 106a, 106b, 106c, 106d is not restricted and depends considerably on the application and the used technology, which will be apparent to a person skilled in the art. E.g. the elements 106a, 106b, 106c, 106d may be evenly distributed on the periphery as in figure 1 or more selectively in key places such as the corners of the touching area.

The applied tactile and/or vibration components providing the electronic device with tactile/vibrating alarm or feedback functionality may comprise at least one piezoelectric actuator or vibration motor. Efficient integration with the housing ensures an efficient tactile feedback to the user.

With integration of multiple tactile and/or vibration components the tactile feedback may be tailored more accurate. The tactile components may be configured in a systematic (matrix etc.), potentially symmetric, formation covering evenly the entire surface or evenly "orbiting" the touch surface, for instance. A formation connected with the touch-sensing components may provide the user with more area-specific feedback providing a supe- rior user experience. E.g. when the entire surface is evenly (at least functionally, e.g. in the periphery) covered by the tactile components and the user provides pressure on a specific point (e.g. touch-based usage with finger or stylus) the nearest tactile component(s) may be configured to respond^) by giving associated vibration/tactile feedback, hence, providing the user with location-wise accurate, targeted feedback, not just vibration/tactile feedback in general. This may be particularly beneficial in multi-touch applications, for example, wherein the user may simultaneously contact a touch surface via multiple points. Figure 2 illustrates, via two axonometric views at 202a and 202b, an embodiment of a device (housing/cover) in accordance with the present invention. View 202a presents more of a front view and 202b a back view of such device. Base material 204 (104) is covered with actual housing mate- rial 210 through molding, preferably, injection molding. Therefore, the elements 106a, 106b, 106c, 106d presented in Figure 1 are preferably firmly integrated in the housing material 210. The shape and size of either the base component 204 (104) or the molded housing 210 is not restricted to any particular form and may thus be manufactured to fit a wide range of applications.

Figure 3 is a flow diagram of one feasible embodiment for manufacturing the solution of the present invention.

At 302, referring to a start-up phase, the necessary tasks such as material, element and tools selection and acquisition take place. In determining the suitable elements and other components/electronics, specific care must be taken that the individual components and material selections work together and survive the selected manufacturing process of the overall arrangement, which is naturally preferably checked up-front on the basis of the manufacturing process vs. element data sheets, or by analyzing the produced prototypes, for example.

At 304, a base material, described previously, is manufactured to a desired shape and size.

At 306, the preferred elements with different functionalities, such as touch sensing components and tactile and/or vibration components are attached to the base material. Supplementary elements and electronics, listed previously, may also be added onto the material. Alternatively, the elements and/or electronics may be provided within the substrate. For example, at least one substrate layer such as a sheet or film may be first provided with electronics such as conductors, and desired control circuitry. The associated chips and other entities may be provided onto the substrate by a flip-chip bonding apparatus or constructed utilizing an inkjet printer, for example.

The used substrate(s) may include, for example, polymers such as a PET (polyethylene terephthalate) or PC (polycarbonate) film. PI may be utilized. Alternatively, e.g. F -4 based substrate may be exploited. An appli- cable substrate shall be generally selected such that the desired flexibility, robustness, and other requirements like adhesion properties in view of the electronics and the adjacent materials, or e.g. in view of available manufacturing techniques, are met.

The selected substrate may also be preconditioned prior to and/or during the illustrated processing phases. The substrate may be preconditioned to increase adhesion with other materials such as injection molded cover plastics, for example.

Elements and electronics may be attached to the target substrates by adhesive, such as an epoxy adhesive, for example. Both conductive (for enabling electrical contact) and non-conductive (for mere fixing) adhesives may be utilized. Such components are preferably selected so as to with- stand the pressure and temperature of the utilized housing component- establishing process such as injection molding process.

Accordingly, suitable printing technologies may also be exploited. E.g. components may be printed on the substrate by an inkjet printer or other applicable device.

Generally, feasible techniques for providing printed electronics may include screen printing, rotary screen printing, gravure printing, flexog- raphy, ink-jet printing, tampo printing, etching (like with PWB-substrates, printed wiring board), transfer laminating, thin-film deposition, etc. For instance, in the context of conductive pastes, silver-based PTF (Polymer Thick Film) paste could be utilized for screen printing the desired circuit design on the substrate. Also e.g. copper or carbon-based PTF pastes may be used. Alternatively, copper/aluminum layers may be obtained by etch- ing. In a further alternative, conductive LTCC (low temperature co-fired ceramic) or HTCC (high temperature co-fired ceramic) pastes may be sintered onto the substrate. One shall take into account the properties of the substrate when selecting the material for conductors. For example, sintering temperature of LTCC pastes may be about 850 to 900°C, which may require using ceramic substrates. Further, silver/gold-based nanoparticle inks could be used for producing the conductors. The paste/ink shall be preferably selected in connection with the printing technique and the substrate material because different printing techniques require different rheological properties from the used ink/paste, for instance. Further, different printing technologies provide varying amounts of ink/paste per time unit, which often affects the achievable conductivity figures.

At 308, the assembly comprising the preferred elements attached to the base material is placed into a mold frame.

Considering the process parameters and set-up, few further guidelines can be given as mere examples as being understood by the skilled persons. When the substrate is PET and the plastics to be, for example, over- molded thereon is PC, the temperature of the melted PC may be about 280 to 320°C and mold temperature about 20 to 95°C, e.g. about 80°C. The used substrate and the process parameters shall be preferably selected such that the substrate does not melt and remains substantially solid during the process. The substrate shall be positioned in the mold such that it remains properly fixed. Likewise, the preinstalled components and/or electronics shall be attached to the substrate such that they remain static during the molding.

At 310, granules of plastic material are poured into the molding device. The material is then heated until molten, and is then force injected into the mold, wherein it sets around the supportive components. Material used is chosen accordingly to the desired features.

Generally in the embodiments of the present invention, the thickness of the established housing as well as the installation depth of said elements and electronics in the housing may be varied according to the application so that they may form a part of the surface (inner or outer surface of the overall electronic device) thereof or be completely embedded, or 'hidden', inside the housing. This enables customization of the toughness, elasticity, transparency, etc., of the constructed device as a whole as well as custom- ization of the maintenance capabilities and protection of said embedded elements. Embedding the elements completely inside the housing typically provides better protection. Optionally leaving the elements to the surface provides less protection but enables easier maintenance or replacement of said elements. Depending on the application certain elements may be embedded entirely, when other elements are only partially embedded.

At 312, the molten material inserted into the mold is kept under a pressure so that the mold becomes even.

At 314, the mold is let to cool down.

At 316, the finished product is taken out of the mold.

At 318, the method execution is ended. Further actions such as element regulation may take place.

At 320, is provided an optional manufacturing method, wherein the ele- ments to be embedded in the housing material are placed directly in the mold frame on preferred places. During this alternative process, steps 304, 306 and 308 are replaced with step 320.

In the above mentioned method, the granular material of injection molding may include, for example, polymers such as PC (polycarbonate), PET (polyethylene terephthalate), PMMA (polymethyl methacrylate), PA (pol- yamide, nylon), COC (cyclo olefin copolymer), and/or COP (cyclo olefin polymer), PTFE (polytetrafluoroethylene) and/or PVC (polyvinyl chloride). Alternatively or additionally, the material may include glass. An ap- plicable layer material shall be generally selected such that the desired flexibility, robustness, and other requirements like adhesion properties in view of the electronics and the adjacent materials, or e.g. in view of available manufacturing techniques, are met. The use of advantageously flexible materials preferably enables carrying out at least some of the method items by roll-to-roll methods, which may provide additional benefits time-, cost- and even space-wise considering e.g. transportation and storage. In roll-to-roll, or 'reel-to-reel', methods the desired components, such as optical and/or electrical ones, may be depos- ited on a continuous 'roll' substrate, which may be both long and wide, advancing either in constant or dynamic speed from a source roll, or a plurality of source rolls, to a destination roll during the procedure. Thus the substrate may thus comprise multiple products that are to be cut separate later.

The roll-to-roll manufacturing advantageously enables rapid and cost ef- fective manufacturing of products also in accordance with the present invention. During the roll-to-roll process several material layers may be joined together On the fly', and the aforesaid components such as electronics may be structured on them prior to, upon, or after the actual joining instant. The source layers and the resulting band-like aggregate entity may be further subjected to various treatments during the process. Layer thicknesses (thinner layers such as 'films' are generally preferred in facilitating roll-to-roll processing) and optionally also other properties should be selected so as to enable roll-to-roll processing to a preferred extent. Figure 4 is a general block diagram of one embodiment of a device comprising the housing and elements embedded therein according to the present invention.

The device 401 may include or constitute, a mobile terminal, a PDA (per- sonal digital assistant), a control device for industrial or other applications, a specific- or multipurpose computer (desktop/laptop/palmtop), a music or multimedia player, etc. As being clear to a skilled person, various elements of the device 401 may be directly integrated in the same housing or provided at least with functional connectivity, e.g. wired or wireless con- nectivity, with each other.

One potential, if not mandatory, component that is included in the apparatus is memory 406, which may be divided between one or more physical memory chips and/or cards, may comprise necessary code, e.g. in a form of a computer program/application, for enabling the control and operation of the apparatus. The memory 406 may include e.g. ROM (read only memory) or RAM -type (random access memory) implementations. The memory 406 may further refer to an advantageously detachable memory card/stick, a floppy disc, an optical disc, such as a CD-ROM, or a fixed/removable hard drive.

A processing component 404, e.g. at least one processing/controlling unit such as a microprocessor, a DSP (digital signal processor), a micro- controller or programmable logic chip(s), optionally comprising a plurality of co-operating or parallel (sub-)units, may be needed for the actual execution of the application code that may be stored in memory 406 as mentioned above.

A display 402 and possible traditional control input means, such as keys, buttons, knobs, voice control interface, sliders, rocker switches, etc. may provide the user of the device 401 with data visualization means and control input means in connection with the display panel 402. Nevertheless, a number of touch sensing components 408 are preferably utilized for implementing the touch based UI in accordance with the present invention.

Tactile and/or vibration components 410 are preferably utilized for providing the electronic device with tactile/vibrating alarm or feedback function- ality in accordance with the present invention.

Data interface 414, e.g. a wireless transceiver (GSM (Global System for Mobile Communications), UMTS (Universal Mobile Telecommunications System), WLAN (Wireless Local Area Network), Bluetooth, infrared, etc), and/or an interface for a fixed/wired connection, such as an USB (Universal Serial Bus) port, a LAN (e.g. Ethernet) interface, or Firewire- compliant (e.g. IEEE 1394) interface, is typically required for communication with other devices. The device may include various alternative or supplementary elements 412a, 412b such as camera, microphone, LED, Ambient Light Sensing and/or Proximity Sensing components as mentioned hereinbefore for providing the device with desired functionalities. It is self-evident that further functionalities may be added to the device and the aforesaid function- alities may be modified depending on each particular embodiment.

The scope of the invention is determined by the attached claims together with the equivalents thereof. The skilled persons will again appreciate the fact that the disclosed embodiments were constructed for illustrative pur- poses only, and the innovative fulcrum reviewed herein will cover further embodiments, embodiment combinations, variations and equivalents that better suit each particular use case of the invention. For instance, instead of a touch display, the suggested solution could be applied to implement a touch pad or some other touch/gesture input device with no mandatory display-associated function. Yet, instead of touch-based control input sensing components or tactile/vibration components, the first and second elements, respectively, could include some other type of functional ele- ments such as the ones described hereinbefore.

Claims

1. An electronic device (401) comprising -a housing (210), such as a cover, comprising housing material molded so as to at least partially embed a plurality of functional elements (106a, 106b, 106c, 106d) associated with at least two different functionalities in said housing material, wherein -a first element (106a, 408) of said plurality comprises a number of user touch-based control input sensing components capable of receiving user touch-based control input for user input acquisition and

-a second element (106b, 410) of said plurality comprises a number of tac- tile and/or vibration components configured to provide the electronic device with tactile/vibrating alarm or feedback functionality.

2. The device of claim 1, wherein the touch-based control input sensing components comprise at least one component selected from the group consisting of: strain, resistive, capacitive and optical sensing component.

3. The device of any preceding claim, wherein the housing is replaceable, optionally without tools such as of snap-fit construction.

4. The device of any preceding claim, wherein the tactile and/or vibration components comprise at least one piezoelectric actuator or vibration motor.

5. The device of any preceding claim, wherein multiple tactile and/or vibration components are configured in a systematic, optionally symmetric, formation in said housing relative to a predetermined reference, such as the location of a display.

6. The device of any preceding claim, configured to provide localized tactile feedback, such as hap tic feedback, via said second element, the location of feedback sensation substantially corresponding to touch location detected by said first element.

7. The device of any preceding claim, comprising a third embedded functional element (106c) including at least one component selected from the group consisting of: a microphone, a loudspeaker, a data processing device, a memory chip, a communications chip, a proximity sensor, and an ambient light sensor.

8. A housing (210) for an electronic device (401), comprising a housing structure of housing material molded so as to at least partially embed a plurality of functional elements (106a, 106b, 106c, 106d) associated with at least two different functionalities in said housing material, wherein a first element (106a, 408) of said plurality comprises a number of user touch-based control input sensing components capable of receiving user touch-based control input for user input acquisition, and a second element (106b, 106c, 106d, 410, 412a, 412b) of said plurality comprises a number of components configured to provide at least one function selected from the group consisting of: tactile feedback, haptic feedback, vibration, communication, sound output, sound input, data processing, data storage, proximity sensing, and ambient light sensing.

9. A system comprising an electronic device (401) and a plurality of housings according to claim 8, wherein each housing is replaceable and contains at least one embedded functional element different from the ones of other housings in said plurality.

10. A method for manufacturing at least part of an electronic device's housing, comprising:

-molding (306, 308, 310, 312, 320) predetermined housing material into a shape so as to at least partially embed a plurality of functional elements associated with at least two different functionalities in said housing material, wherein

-a first element (106a, 408) of said plurality comprising a number of user touch-based control input sensing components capable of receiving user touch-based control input for user input acquisition and

-a second element (106b, 106c, 106d, 410, 412a, 412b) of said plurality comprising a number of components configured to provide at least one function selected from the group consisting of: tactile feedback, haptic feedback, vibration, communication, sound output, sound input, data processing, data storage, proximity sensing, and ambient light sensing.

1 1. The method of claim 10, wherein the first and second elements are provided on at least one base component (306).

12. The method of any of claims 10-1 1, wherein the molding incorporates over- molding, preferably injection molding.