WO2009082868A1 - Solar cell board and fabricating method thereof - Google Patents

Solar cell board and fabricating method thereof Download PDF

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Publication number
WO2009082868A1
WO2009082868A1 PCT/CN2008/000534 CN2008000534W WO2009082868A1 WO 2009082868 A1 WO2009082868 A1 WO 2009082868A1 CN 2008000534 W CN2008000534 W CN 2008000534W WO 2009082868 A1 WO2009082868 A1 WO 2009082868A1
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Prior art keywords
solar
electrode
wafer
positive
pcb
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PCT/CN2008/000534
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French (fr)
Chinese (zh)
Inventor
Dongqi Wang
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Dongqi Wang
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Publication of WO2009082868A1 publication Critical patent/WO2009082868A1/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042PV modules or arrays of single PV cells
    • H01L31/05Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy

Definitions

  • the present invention relates to the technical field of design of solar panels, and more particularly to a solar panel and a method of fabricating the same. Background technique
  • Solar panels are a core part of solar power systems and the most valuable part of solar power systems. They are used to convert the sun's radiation capacity into electrical energy, or to be stored in batteries, or to drive loads. The quality and cost of solar panels will directly determine the quality and cost of the entire system.
  • the positive and negative electrodes of a commonly used solar wafer are respectively distributed on both sides of a battery wafer.
  • a solar wafer it is necessary to use manual soldering, soldering and drawing the positive and negative electrodes of the solar wafer on both sides of the battery wafer, and then manually attaching the solar wafer to the PCB and soldering the leads to the PCB.
  • This type of production greatly affects production efficiency and product reliability, and cannot achieve high-efficiency and high-volume production.
  • An object of the present invention is to provide a solar panel and a manufacturing method thereof, the sun Energy panels can be widely used in solar lamps and mobile power supplies, and can be used
  • the SMT process is mass-produced, and the technical problem to be solved is to improve the productivity of the production and the reliability of the product.
  • the solar panel of the present invention is provided with a mounting position of at least one set of solar wafers on one side of the PCB board of the solar panel, and a plurality of staggered pads are disposed on each set of mounting positions.
  • a positive and negative electrode for respectively connecting the solar wafers a solar wafer is attached to each set of mounting positions, and each of the solar wafers constitutes a single battery; and two electrode weldings are also disposed on the same side of the PCB Disk, all the cells composed of solar wafers are connected in series or in parallel through the conduction belts to connect two sets of electrode pads, wherein one set of electrode pads serves as the positive output of the power supply, and the other set of electrode pads serves as the negative of the power supply.
  • a positive and negative electrode for respectively connecting the solar wafers
  • a solar wafer is attached to each set of mounting positions, and each of the solar wafers constitutes a single battery
  • two electrode weldings are also disposed on the same side of the PCB Disk, all the
  • a test point is respectively disposed on each side of each solar chip, wherein one test point connects all the pads connected to the positive electrode of the solar chip through the conduction band, and another test point All of the pads connected to the negative electrode of the solar wafer are connected by a conduction band.
  • at least one pad is disposed on the conduction band connecting the same electrode of the solar wafer.
  • Each of the solar wafers is a small solar chip that is cut to a length of 30 to 40 mm or 40 to 50 mm, and each of the solar small wafers has at least one set of positive and negative electrodes.
  • the conduction band and the pad width connecting the positive electrode of the solar wafer are smaller than the positive electrode width of the solar wafer, and the width of the conduction band and the disk connected to the negative electrode of the solar wafer is smaller than the negative electrode width of the solar wafer.
  • two element through holes are disposed on each of the electrode pads for guiding the electrodes to the other side of the PCB board through jumpers.
  • the PCB board is provided with at least two positioning holes for precise alignment in the automatic patching process.
  • the method is carried out according to the following steps: A. drawing a circuit board according to requirements, and setting a mounting position of at least one set of solar wafers on one side of the PCB board, in each group of mounting positions Providing a plurality of staggered pads for respectively connecting the positive and negative electrodes of the solar wafer; and providing two sets of electrode pads on the same side of the PCB, all the solders connected to the positive and negative electrodes of the solar wafer The points are respectively connected to the two sets of electrode pads through the conduction band, wherein one set of electrode pads serves as a positive output of the power source, and the other set of electrode pads serves as a negative output of the power source; B.
  • a silk screen is displayed on the PCB to indicate a positioning line And indicating the orientation of the patch in the silk screen; C. positioning the PCB board, and mounting the solar wafer on the PCB board by using an SMT process to fabricate a solar panel.
  • each solar wafer is pre-fixed with a high temperature resistant adhesive or the like, for example, the adhesive may be preferably red plastic, and the solar cell wafer is positioned by using an auxiliary positioning fixture.
  • the structural design of the solar panel of the present invention can be combined with a new high-efficiency solar wafer represented by SUNPOWER, USA (as shown in FIG. 2, the special structure solar wafer has the positive electrode and the negative electrode on the same side of the solar cell crystal. ) and SMT process (surface mount technology, SMT for efficient mass production), the solar panel of this structure has a photoelectric conversion efficiency of up to 22%, and its product has compact structure, small size, vibration resistance and impact resistance. Excellent performance and high production efficiency.
  • the invention completely overcomes the defects that the existing solar panel must be manually soldered, and adopts the advanced SMT process design. It is a new type of PCB solar panel, especially suitable for high-efficiency mass production, and can improve product performance and reliability. Sex, reduce production costs.
  • the solar panel of the invention can be widely used in solar lawn lamps, garden lamps, street lamps and mobile power sources.
  • FIG. 1 is a schematic structural view of a solar panel in the prior art.
  • FIG. 2 is a schematic structural view of a novel solar wafer.
  • FIG. 3 is a schematic view showing the circuit design structure of a solar cell PCB printed board according to the present invention.
  • 4 is a schematic structural view of the PCB printed board of FIG. 3 after being packaged.
  • Fig. 5 is a structural schematic view of a solar panel using the PCB of the structure of Fig. 3.
  • Fig. 6 is a schematic view showing the structure of another embodiment of the solar cell PCB printed board of the present invention.
  • Fig. 7 is a schematic structural view showing still another embodiment of a solar cell PCB printed board of the present invention. detailed description
  • the present invention mainly provides a structural design of a solar panel.
  • the structure of the PCB board of the solar panel of the present invention is as shown in FIG. 3.
  • On one side of the PCB board 200 at least one set of mounting positions 210 of solar wafers for automatically or manually mounting the solar wafers is provided.
  • Group placement bit 20 is provided with a plurality of interleaved points
  • the solder joints 211 of the cloth are used to respectively connect the positive and negative electrodes of the solar wafer; on the same side of the PCB board 200, two sets of electrode pads 240 are further disposed, and all the solder joints 211 connected to the positive and negative electrodes of the solar wafer pass through
  • the conduction strips 230, 231, and 232 are respectively connected to the two sets of electrode pads 240, wherein one set of the electrode pads 240 serves as the positive output of the power source, and the other set of the electrode pads 240 serves as the negative output of the power source.
  • the package can form the solar cell of the present invention.
  • the board as shown in FIG. 5, is mounted with a solar wafer on each set of mounting positions, and each of the solar wafers constitutes a single battery, and the positive and negative electrodes pass through the solder joints 211 and the conduction strips 231, 232 connected thereto.
  • the positive and negative electrodes of the single cell are led to both sides of the solar wafer, and then all the cells composed of the solar wafer are connected in series or in parallel through the conduction band 230, and then the two sets of electrode pads 240 are respectively connected to provide different voltages for the user. And current.
  • each of the above-mentioned electrode pads can be set as two pads, and each group of pads is appropriately staggered. According to the needs of different occasions, design PCB boards with different sizes or different specifications.
  • the above solar cell PCB board is designed to apply solar wafers with positive and negative electrodes on the same side, and uses SMT technology to achieve high-volume patch production.
  • a new type of high-efficiency solar wafer represented by SU POWER in the United States has a special structure.
  • the positive and negative electrodes of the solar wafer are distributed on the same side of the battery wafer.
  • the positive electrode width is about 0.9mm, or l.lmm, or 1.3mm, or 1.5mm
  • the negative electrode width is about 0.23mm, or 0.29mm, or 0.28mm, or 0.4mm
  • the spacing between the positive and negative electrodes is about 0.33mm, or 0.3mm, or 0.37mm, or 0.2mm.
  • Each set of electrodes can provide a voltage of about 0.6V, through the string
  • each solar wafer can be cut into solar small wafers having a length of 30 ⁇ 40mm or 40 ⁇ 50mm, and each solar small wafer has at least one set of positive and negative electrodes, such as two electrodes, three electrodes, A multi-electrode solar small wafer such as a four-electrode is then mounted on a PCB for serial and parallel connection to obtain the required current and voltage.
  • each small wafer has a size of about 42 mm x 6 mm or 42 mm x 7 mm (corresponding to different wafer types) Cutting).
  • Three sets of positive and negative electrodes are reserved on the PCB, the positive and negative poles are connected in parallel, and the whole board uses seven wafers to cross each other; ⁇ output can reach 4.2V voltage, 80mA current, and the entire PCB board size can be 60mm x 60mm.
  • Two electrode pads 240 may be designed in the middle of the PCB board, and two element via holes are provided in each of the electrode pads, which may connect the output electrodes of the power source to the other side of the PCB board 200 through jumpers, which A structural design can be applied to other embodiments.
  • the present invention also shows an embodiment of the other two PCB boards.
  • each solar wafer has a size of 31 mm X 6 mm (or 31 mm x 7 mm), and three sets of positive and negative electrodes are reserved, and the positive and negative electrodes are respectively connected in parallel.
  • the whole board uses two solar chips in series to output a current of 1.2V and 50mA, and the entire PCB board size is 46mm x l9mm.
  • each solar wafer has a size of 31mm X 4mm (or 31mm x 5mm), and two sets of positive and negative electrodes are reserved, and the positive and negative electrodes are respectively connected in parallel, and the whole plate is connected in series with four wafers to achieve a voltage of 2.4V. , 35mA current.
  • the entire PCB board has a size of 60mm x 60mm square and a diameter of 65mm, and the middle design pad.
  • several positioning holes 300 can be designed, which is convenient for batching by SMT process. Precise positioning during production.
  • a test point 220 is further disposed on each side of each of the solar panels (ie, each set of mounting locations 210) for each of The voltage or current provided by the single cell composed of the solar wafer is tested to facilitate the on-off test of the solar panel produced by the SMT process in large quantities to ensure the batch yield of the product.
  • the test point 220 on the left side of each solar wafer is connected to all the solder joints 211 connected to the positive electrode of the solar wafer through a conduction band (ie, 231 in FIG. 3), and the test point 220 on the right side thereof passes through the conduction band (ie, 232) in Fig.
  • the widths of the conduction strips 231 and the pads 211 connecting the positive electrodes of the solar wafer are smaller than the positive electrode width of the solar wafer, and the negative electrodes of the solar wafer are connected.
  • the width of the conduction band 232 and the pad 211 is smaller than the positive electrode width of the solar wafer, and this is for effectively avoiding a phenomenon in which the positive and negative electrodes are short-circuited during the automatic placement welding.
  • the width of the conduction band 231 connecting the positive electrode of the solar wafer may be within the mounting position. 0.3 to 0.4 mm, the width of the conduction band 232 connecting the negative electrode of the solar wafer can be For 0.1 ⁇ 0.29mm, the optimal choice is 0.2 mm.
  • FIG. 3 it can be seen that, on the same side of the PCB board, in each set of mounting locations 210, at least one pad is disposed on the conductive strip connecting the same electrode of the solar wafer, and a plurality of soldering is ensured. In the case of the disk, each solder joint has a certain interval and is staggered. This is to avoid the phenomenon that the electrode is broken when performing automatic placement welding.
  • the solar panel of the present invention can adopt a small-sized solar wafer, that is, it can be cut into small wafers by using a waste solar wafer board, and then the PCB board design of the present invention can be adopted as needed.
  • the combination is made into a solar cell, which can effectively reduce the manufacturing cost of the solar panel and reduce the waste of resources.
  • the present invention also provides a method of fabricating a solar cell, the method being carried out according to the following process:
  • Point for connecting the positive and negative electrodes of the solar wafer respectively; two sets of electrode pads are disposed on the same side of the PCB board, and all the solder joints connected to the positive and negative electrodes of the solar wafer are respectively connected to the two sets of electrodes through the conduction band A pad, wherein one set of electrode pads serves as a positive output of the power source and the other set of electrode pads serves as a negative output of the power source.
  • the board thickness is preferably about 1.2 mm to 1.6 mm, and according to Different usage requirements can be set Different PCB board versions.
  • At least two positioning holes (such as the positioning holes 300 in FIG. 3 to FIG. 7) need to be disposed on the PCB, mainly for accurately aligning in the automatic patching process, preventing the board from sliding, thereby affecting the sticking of the solar wafer. Install the effect.
  • a silk screen indicating positioning line is set on the above PCB board, and the patch direction is indicated in the silk screen, so that each solar chip can be accurately positioned and avoided by the SMT process, and the large offset can be avoided. Open or short circuit of the electrode during mass production.
  • the above PCB board is positioned, and a solar wafer is mounted on the PCB by an SMT process to fabricate a solar panel. Since the solar wafer used is only 270 ⁇ m thick, it is fragile and fragile. Therefore, the following points should be noted when performing the above SMT production process:
  • nozzles and suitable mold fixtures for different specifications of solar wafer design can be extended to meet the needs of rectangular solar wafers, and auxiliary positioning fixtures for solar energy The wafer is positioned;
  • each solar wafer is pre-fixed with a red glue or the like at the same time as the patch;

Abstract

A solar cell board and fabricating method thereof are provided. On one side of the PCB board (200) of the solar cell board, there are arranged at least one set of mounting sites (210) for solar wafer, there are arranged a plurality solder points (211) staggered on each set of the mounting sites (210), for connecting the positive electrode, negative electrode of the solar wafer, respectively; there are mounted a solar wafer on each set of the mounting sites, each of the solar wafer constructs a single cell; there are arranged two electrode pads (240) on the same side of the PCB board, all of the single cells are connected in series or in parallel and thereafter connected to the two electrode pads (240), respectively, therein, one of the electrode pads acts as positive output of the source, and the other acts as the negative output of the source.

Description

一种太阳能电池板及其制作方法  Solar panel and manufacturing method thereof
技术领域 Technical field
本发明涉及太阳能电池板的设计技术领域,尤其涉及一种太阳能 电池板及其制作方法。 背景技术  The present invention relates to the technical field of design of solar panels, and more particularly to a solar panel and a method of fabricating the same. Background technique
太阳能电池板是太阳能发电系统中的核心部分,也是太阳能发电 系统中价值最高的部分,其作用是将太阳的辐射能力转换为电能,或 送往蓄电池中存储起来, 或推动负载工作。 太阳能电池板的质量和成 本将直接决定整个系统的质量和成本。  Solar panels are a core part of solar power systems and the most valuable part of solar power systems. They are used to convert the sun's radiation capacity into electrical energy, or to be stored in batteries, or to drive loads. The quality and cost of solar panels will directly determine the quality and cost of the entire system.
目前, 常用的太阳能晶片的正负电极分别分布在电池晶片的两 面。 对于这样的太阳能晶片, 必须采用手工焊接的方式, 在电池晶片 的两面分别用导线焊接并引出太阳能晶片的正、 负电极, 然后将太阳 能晶片手工粘贴在 PCB板上并将引线焊接在 PCB板上,如图 1所示。 这样的制作方式,极大地影响了生产效率和产品的可靠性, 无法实现 高效率大批量的生产。  At present, the positive and negative electrodes of a commonly used solar wafer are respectively distributed on both sides of a battery wafer. For such a solar wafer, it is necessary to use manual soldering, soldering and drawing the positive and negative electrodes of the solar wafer on both sides of the battery wafer, and then manually attaching the solar wafer to the PCB and soldering the leads to the PCB. ,As shown in Figure 1. This type of production greatly affects production efficiency and product reliability, and cannot achieve high-efficiency and high-volume production.
但是, 随着大众对新能源的开发和使用, 以及大众环保节能意识 的提高, 使得对太阳能电池的需求越来越大。 因此, 就需要改进对太 阳能电池板结构的设计, 用于满足大批量生产的需要。 发明内容  However, with the development and use of new energy by the public and the awareness of the public's environmental protection and energy conservation, the demand for solar cells is increasing. Therefore, there is a need to improve the design of solar panel structures to meet the needs of mass production. Summary of the invention
本发明的目的在于提供一种太阳能电池板及其制作方法,其太阳 能电池板可以广泛应用于太阳能灯具和移动电源上, 而且可以采用An object of the present invention is to provide a solar panel and a manufacturing method thereof, the sun Energy panels can be widely used in solar lamps and mobile power supplies, and can be used
SMT 工艺进行大批量生产, 要解决的技术问题是提高制作的生 '产效 率和产品的可靠性。 The SMT process is mass-produced, and the technical problem to be solved is to improve the productivity of the production and the reliability of the product.
为了达到上述目的, 本发明采用如下技术方案:  In order to achieve the above object, the present invention adopts the following technical solutions:
本发明的太阳能电池板, 在所述太阳能电池板的 PCB板的一面 上,设置有至少一组太阳能晶片的贴装位, 在每一组贴装位上设置有 多个交错分布的焊盘, 用于分别连接太阳能晶片的正、 负电极; 在每 一组贴装位上贴装有一太阳能晶片, 每一个太阳能晶片构成一单电 池; 所述 PCB板的同一面上还设置有两个电极焊盘, 所有由太阳能 晶片构成的单电池通过导带串联或并联后分别连接两组电极焊盘,其 中,一组电极焊盘作为电源的正极输出, 另一组电极焊盘作为电源的 负才及 出。  The solar panel of the present invention is provided with a mounting position of at least one set of solar wafers on one side of the PCB board of the solar panel, and a plurality of staggered pads are disposed on each set of mounting positions. a positive and negative electrode for respectively connecting the solar wafers; a solar wafer is attached to each set of mounting positions, and each of the solar wafers constitutes a single battery; and two electrode weldings are also disposed on the same side of the PCB Disk, all the cells composed of solar wafers are connected in series or in parallel through the conduction belts to connect two sets of electrode pads, wherein one set of electrode pads serves as the positive output of the power supply, and the other set of electrode pads serves as the negative of the power supply. Out.
其中, 在所述 PCB板的同一面上, 每一个太阳能晶片的两侧分 别设置有一测试点, 其中, 一个测试点通过导带连接所有与该太阳能 晶片正电极相连的焊盘,另一个测试点通过导带连接所有与该太阳能 晶片的负电极相连的焊盘。 其中, 在每一贴装位内, 连接太阳能晶片 同一电极的导带上设置有至少一个焊盘。每一个太阳能晶片为切割成 长度是 30 ~ 40mm或 40 ~ 50mm的太阳能小晶片,每一个太阳能小晶 片至少有一组正负电极。  Wherein, on the same side of the PCB board, a test point is respectively disposed on each side of each solar chip, wherein one test point connects all the pads connected to the positive electrode of the solar chip through the conduction band, and another test point All of the pads connected to the negative electrode of the solar wafer are connected by a conduction band. Wherein, in each of the mounting positions, at least one pad is disposed on the conduction band connecting the same electrode of the solar wafer. Each of the solar wafers is a small solar chip that is cut to a length of 30 to 40 mm or 40 to 50 mm, and each of the solar small wafers has at least one set of positive and negative electrodes.
其中,在所述贴装位内, 连接太阳能晶片正电极的导带及焊盘宽 度小于太阳能晶片的正电极宽度,连接太阳能晶片负电极的导带及悍 盘宽度小于太阳能晶片的负电极宽度。 其中, 在所述每个电极焊盘上设置有两个元件通孔, 用于通过跳 线将电极引向所述 PCB板的另一面。 其中, 所述 PCB板上设置有至 少两个定位孔, 用于自动贴片流程中进行精确对位。 Wherein, in the mounting position, the conduction band and the pad width connecting the positive electrode of the solar wafer are smaller than the positive electrode width of the solar wafer, and the width of the conduction band and the disk connected to the negative electrode of the solar wafer is smaller than the negative electrode width of the solar wafer. Wherein, two element through holes are disposed on each of the electrode pads for guiding the electrodes to the other side of the PCB board through jumpers. The PCB board is provided with at least two positioning holes for precise alignment in the automatic patching process.
上述太阳能电池板的制作方法,所述方法按照以下步骤进行: A、 根据需求绘制电路制作 PCB板, 在 PCB板的一面上设置至少一组太 阳能晶片的贴装位,在每一组贴装位上设置多个交错分布的焊盘, 用 于分别连接太阳能晶片的正、 负电极; 在所述 PCB板的同一面上还 设置两组电极焊盘, 与太阳能晶片正、 负电极相连的所有焊点通过导 带分别连接两组电极焊盘,其中,一组电极焊盘作为电源的正极输出, 另一组电极焊盘作为电源的负极输出; B、在所述 PCB板上设置丝印 指示定位线, 并在丝印中指明贴片方向; C、 将所述 PCB板定位, 并 采用 SMT工艺在所述 PCB板上贴装太阳能晶片,制作太阳能电池板。 其中, 所述步骤 C 中, 采用耐高温的粘合剂等对每一个太阳能晶片 进行预固定, 如粘合剂可以优选红胶, 以及采用辅助定位夹具对太阳 能晶片进行定位。  In the above method for manufacturing a solar panel, the method is carried out according to the following steps: A. drawing a circuit board according to requirements, and setting a mounting position of at least one set of solar wafers on one side of the PCB board, in each group of mounting positions Providing a plurality of staggered pads for respectively connecting the positive and negative electrodes of the solar wafer; and providing two sets of electrode pads on the same side of the PCB, all the solders connected to the positive and negative electrodes of the solar wafer The points are respectively connected to the two sets of electrode pads through the conduction band, wherein one set of electrode pads serves as a positive output of the power source, and the other set of electrode pads serves as a negative output of the power source; B. a silk screen is displayed on the PCB to indicate a positioning line And indicating the orientation of the patch in the silk screen; C. positioning the PCB board, and mounting the solar wafer on the PCB board by using an SMT process to fabricate a solar panel. Wherein, in the step C, each solar wafer is pre-fixed with a high temperature resistant adhesive or the like, for example, the adhesive may be preferably red plastic, and the solar cell wafer is positioned by using an auxiliary positioning fixture.
本发明的太阳能电池板的结构设计, 可以结合以美国 SUNPOWER公司为代表的新型高效太阳能晶片 (如图 2所示, 此种 特殊结构太阳能晶片其正电极和负电极在太阳能电池晶体的同一面 上)和 SMT工艺(表面安装技术, 简称 SMT )进行高效大批量生产, 使得这种结构的太阳能电池板的光电转换效率高达 22 % , 而且其产 品具有结构紧凑、 体积小、 耐振动、 抗冲击, 性能优、 生产效率高等 优点。 本发明彻底克服了现有的太阳能电池板必须手工焊接的不足,率 先采用先进的 SMT工艺设计, 是一种新型 PCB太阳能电池板, 尤其 是能适用于高效批量生产, 并且能提高产品性能及可靠性、 降低生产 成本。 本发明的太阳能电池板能广泛用于太阳能草坪灯、 庭院灯、 路 灯及移动电源上。 附图说明 The structural design of the solar panel of the present invention can be combined with a new high-efficiency solar wafer represented by SUNPOWER, USA (as shown in FIG. 2, the special structure solar wafer has the positive electrode and the negative electrode on the same side of the solar cell crystal. ) and SMT process (surface mount technology, SMT for efficient mass production), the solar panel of this structure has a photoelectric conversion efficiency of up to 22%, and its product has compact structure, small size, vibration resistance and impact resistance. Excellent performance and high production efficiency. The invention completely overcomes the defects that the existing solar panel must be manually soldered, and adopts the advanced SMT process design. It is a new type of PCB solar panel, especially suitable for high-efficiency mass production, and can improve product performance and reliability. Sex, reduce production costs. The solar panel of the invention can be widely used in solar lawn lamps, garden lamps, street lamps and mobile power sources. DRAWINGS
图 1为现有技术中太阳能电池板的结构示意图。  FIG. 1 is a schematic structural view of a solar panel in the prior art.
图 2为新型太阳能晶片的结构示意图。  2 is a schematic structural view of a novel solar wafer.
图 3为本发明太阳能电池 PCB印制板的电路设计结构示意图。 图 4为图 3的 PCB印制板封装后的结构示意图。  3 is a schematic view showing the circuit design structure of a solar cell PCB printed board according to the present invention. 4 is a schematic structural view of the PCB printed board of FIG. 3 after being packaged.
图 5为采用图 3结构的 PCB板的太阳能电池板的结构示意图。 图 6为本发明太阳能电池 PCB印制板的另一实施例的结构示意 图。  Fig. 5 is a structural schematic view of a solar panel using the PCB of the structure of Fig. 3. Fig. 6 is a schematic view showing the structure of another embodiment of the solar cell PCB printed board of the present invention.
图 7为本发明太阳能电池 PCB印制板的又一实施例的结构示意 图。 具体实施方式  Fig. 7 is a schematic structural view showing still another embodiment of a solar cell PCB printed board of the present invention. detailed description
以下结合附图详细说明本发明的技术方案。  The technical solution of the present invention will be described in detail below with reference to the accompanying drawings.
如图 3和图 4所示,本发明主要提供了一种太阳能电池板的结构 设计方案。本发明太阳能电池板的 PCB板的结构如图 3所示,在 PCB 板 200的一面上设置有至少一组太阳能晶片的贴装位 210, 其用于自 动或手动贴装太阳能晶片, 在每一组贴装位 20上设置有多个交错分 布的焊点 211 , 用于分别连接太阳能晶片的正、 负电极; 在 PCB板 200的同一面上还设置有两組电极焊盘 240, 与太阳能晶片正、 负电 极相连的所有焊点 211通过导带 230、 231、 232分别连接两组电极焊 盘 240, 其中, 一组电极焊盘 240作为电源的正极输出, 另一组电极 悍盘 240作为电源的负极输出。 在上述结构的 PCB板 200的各组贴 装位 210上采用手动或自动的方式贴装太阳能晶片(此概念包括太阳 能晶片的切片,下同)后,封装即可形成本发明所说的太阳能电池板, 如图 5所示, 在每一组贴装位上贴装一太阳能晶片, 而每一个太阳能 晶片构成一单电池, 其正、 负电极通过与其相连的焊点 211 和导带 231、 232将单电池的正、 负电极引向太阳能晶片的两侧, 然后所有 由太阳能晶片构成的单电池通过导带 230 串联或并联后分别连接上 述两组电极焊盘 240, 为用户提供不同大小的电压和电流。 当然上述 每组电极焊盘可以设置为两个焊盘,各组焊盘适当错开。根据不同场 合的需求, 设计大小不同或不同规格的 PCB板。 As shown in FIG. 3 and FIG. 4, the present invention mainly provides a structural design of a solar panel. The structure of the PCB board of the solar panel of the present invention is as shown in FIG. 3. On one side of the PCB board 200, at least one set of mounting positions 210 of solar wafers for automatically or manually mounting the solar wafers is provided. Group placement bit 20 is provided with a plurality of interleaved points The solder joints 211 of the cloth are used to respectively connect the positive and negative electrodes of the solar wafer; on the same side of the PCB board 200, two sets of electrode pads 240 are further disposed, and all the solder joints 211 connected to the positive and negative electrodes of the solar wafer pass through The conduction strips 230, 231, and 232 are respectively connected to the two sets of electrode pads 240, wherein one set of the electrode pads 240 serves as the positive output of the power source, and the other set of the electrode pads 240 serves as the negative output of the power source. After mounting the solar wafers manually or automatically on the various sets of mounting locations 210 of the PCB board 200 of the above structure (the concept includes the slicing of the solar wafers, the same below), the package can form the solar cell of the present invention. The board, as shown in FIG. 5, is mounted with a solar wafer on each set of mounting positions, and each of the solar wafers constitutes a single battery, and the positive and negative electrodes pass through the solder joints 211 and the conduction strips 231, 232 connected thereto. The positive and negative electrodes of the single cell are led to both sides of the solar wafer, and then all the cells composed of the solar wafer are connected in series or in parallel through the conduction band 230, and then the two sets of electrode pads 240 are respectively connected to provide different voltages for the user. And current. Of course, each of the above-mentioned electrode pads can be set as two pads, and each group of pads is appropriately staggered. According to the needs of different occasions, design PCB boards with different sizes or different specifications.
上述太阳能电池板 PCB板的结构设计主要是为了应用正、 负电 极均在同一面的太阳能晶片, 并采用 SMT工艺实现大批量的贴片生 产。 以美国 SU POWER公司为代表的新型高效太阳能晶片', 此种太 阳能晶片具有特殊的结构, 其太阳能晶片的正、 负电极均分布在电池 晶片的同一面上, 对于不同型号, 其正电极宽度约为 0.9mm、 或 l.lmm、或 1.3mm、或 1.5mm, 负电极宽度约为 0.23mm、或 0.29mm、 或 0.28mm、或 0.4mm,正、负电极间的间距约为 0.33mm、或 0.3mm、 或 0.37mm、 或 0.2mm。 每一组电极可提供的电压约为 0.6V, 通过串  The above solar cell PCB board is designed to apply solar wafers with positive and negative electrodes on the same side, and uses SMT technology to achieve high-volume patch production. A new type of high-efficiency solar wafer represented by SU POWER in the United States has a special structure. The positive and negative electrodes of the solar wafer are distributed on the same side of the battery wafer. For different models, the positive electrode width is about 0.9mm, or l.lmm, or 1.3mm, or 1.5mm, the negative electrode width is about 0.23mm, or 0.29mm, or 0.28mm, or 0.4mm, the spacing between the positive and negative electrodes is about 0.33mm, or 0.3mm, or 0.37mm, or 0.2mm. Each set of electrodes can provide a voltage of about 0.6V, through the string
S 联可提供更高电压。选取不同的长度,可提供不同的电流;通过并联, 可提供更大的电流。 因此, 根据不同的设计需要, 每一个太阳能晶片 可以为切割成长度是 30 ~ 40mm或 40 ~ 50mm的太阳能小晶片,每一 个太阳能小晶片要至少有一组正负电极, 如双电极、 三电极、 四电极 等多电极的太阳能小晶片, 然后再贴装在 PCB板上进行串、 并联, 得到所需的电流、 电压。 S A higher voltage can be supplied. Different lengths are available to provide different currents; more parallel currents provide more current. Therefore, according to different design requirements, each solar wafer can be cut into solar small wafers having a length of 30 ~ 40mm or 40 ~ 50mm, and each solar small wafer has at least one set of positive and negative electrodes, such as two electrodes, three electrodes, A multi-electrode solar small wafer such as a four-electrode is then mounted on a PCB for serial and parallel connection to obtain the required current and voltage.
采用太阳能晶片的切片来设计太阳能电池时,需要根据太阳能小 晶片的规格, 来制定 PCB板上贴装位等的大小。 如图 3所示, 其设 置了 7组用于贴装太阳能小晶片的的贴装位 210, 其中, 每个小晶片 的尺寸大约为 42mm x 6mm或 42mm x 7mm (由不同的晶片种类作 相应切割)。 在 PCB板上保留三组正负电极, 其正负极分别并联, 而 整板采用七块晶片相互串; ^输出可达到 4.2V电压、 80mA的电流, 而整个 PCB板的尺寸可以为 60mm x 60mm。 在 PCB板的中间可以 设计两个电极焊盘 240, 并在每个电极焊盘中设置有两个元件通孔, 其可通过跳线将电源的输出电极连接到 PCB板 200的另一面, 这一 结构设计可以应用到其他实施例中。如图 6和图 7所示, 本发明还给 出了另两个 PCB板的实施例。图 6中,每个太阳能晶片的尺寸为 31mm X 6mm (或 31mm x 7mm ), 保留三组正负电极, 正负极分别并联。 整板采用两块太阳能晶片串联后输出可达到 1.2V电压、 50mA的电 流, 而整个 PCB板的尺寸为 46mm x l9mm。 如图 7中, 每个太阳能 晶片的尺寸为 31mm X 4mm (或 31mm x 5mm ), 保留两組正负电极, 正负极分别并联,而整板采用四块晶片串联后输出可达到 2.4V电压、 35mA的电流。而整个 PCB板的尺寸为 60mm x 60mm的方形和直径 65mm的圆形, 中间设计焊盘, 对于圆形的 PCB板在定位时, 可以 多设计几个定位孔 300, 便于在采用 SMT工艺进行批量生产时进行 精确定位。 When designing a solar cell using a slice of a solar wafer, it is necessary to determine the size of a mounting position on the PCB according to the specifications of the small solar chip. As shown in FIG. 3, it is provided with 7 sets of mounting sites 210 for mounting solar small wafers, wherein each small wafer has a size of about 42 mm x 6 mm or 42 mm x 7 mm (corresponding to different wafer types) Cutting). Three sets of positive and negative electrodes are reserved on the PCB, the positive and negative poles are connected in parallel, and the whole board uses seven wafers to cross each other; ^ output can reach 4.2V voltage, 80mA current, and the entire PCB board size can be 60mm x 60mm. Two electrode pads 240 may be designed in the middle of the PCB board, and two element via holes are provided in each of the electrode pads, which may connect the output electrodes of the power source to the other side of the PCB board 200 through jumpers, which A structural design can be applied to other embodiments. As shown in Figures 6 and 7, the present invention also shows an embodiment of the other two PCB boards. In Fig. 6, each solar wafer has a size of 31 mm X 6 mm (or 31 mm x 7 mm), and three sets of positive and negative electrodes are reserved, and the positive and negative electrodes are respectively connected in parallel. The whole board uses two solar chips in series to output a current of 1.2V and 50mA, and the entire PCB board size is 46mm x l9mm. As shown in Fig. 7, each solar wafer has a size of 31mm X 4mm (or 31mm x 5mm), and two sets of positive and negative electrodes are reserved, and the positive and negative electrodes are respectively connected in parallel, and the whole plate is connected in series with four wafers to achieve a voltage of 2.4V. , 35mA current. The entire PCB board has a size of 60mm x 60mm square and a diameter of 65mm, and the middle design pad. For positioning of the circular PCB board, several positioning holes 300 can be designed, which is convenient for batching by SMT process. Precise positioning during production.
如图 3和图 4所示, 在 PCB板的同一面上, 每一个太'阳能晶片 (即每一组贴装位 210 )的两侧还分别设置有一测试点 220, 用于对 每一个太阳能晶片构成的单电池所提供的电压或电流进行测试,便于 对采用 SMT工艺大批量生产的太阳能电池板进行通断测试, 保证产 品的批量合格率。 图 5中,每一个太阳能晶片左边的测试点 220通过 导带(即图 3中的 231 )连接所有与该太阳能晶片正电极相连的焊点 211, 而其右边的测试点 220通过导带(即图 3中的 232 )连接所有 与该太阳能晶片的负电极相连的焊点 211。 从图 3至图 7可以看出, 这一结构特征也可以应用其他实施例中 , 同样在封装 PCB板后, 测 试点需要裸露在外 , 便于自动贴装太阳能晶片后对其进行测试。  As shown in FIG. 3 and FIG. 4, on the same side of the PCB board, a test point 220 is further disposed on each side of each of the solar panels (ie, each set of mounting locations 210) for each of The voltage or current provided by the single cell composed of the solar wafer is tested to facilitate the on-off test of the solar panel produced by the SMT process in large quantities to ensure the batch yield of the product. In FIG. 5, the test point 220 on the left side of each solar wafer is connected to all the solder joints 211 connected to the positive electrode of the solar wafer through a conduction band (ie, 231 in FIG. 3), and the test point 220 on the right side thereof passes through the conduction band (ie, 232) in Fig. 3 connects all the solder joints 211 connected to the negative electrode of the solar wafer. As can be seen from Fig. 3 to Fig. 7, this structural feature can also be applied in other embodiments. Also after the PCB board is packaged, the test pilot needs to be exposed, so that it can be tested after the solar wafer is automatically mounted.
从图 3中可以看出, 在进行 PCB设计时, 在贴装位 210内, 连 接太阳能晶片正电极的导带 231及焊盘 211的宽度小于太阳能晶片的 正电极宽度,连接太阳能晶片负电极的导带 232及焊盘 211的宽度小 于太阳能晶片的正电极宽度, 这样做是为了在进行自动贴装焊接时, 有效避免正、 负极发生短路的现象。 例如, 如果本发明采用上述正电 极宽度约为 0.9mm、 负电极宽度约为 0.23mm的结构和尺寸大小的太 阳能晶片, 则在贴装位内, 连接太阳能晶片正电极的导带 231的宽度 可以为 0.3 ~ 0.4mm, 连接太阳能晶片负电极的导带 232的宽度可以 了 为 0.1 ~ 0.29mm, 最优选择是 0.2 mm。 而且在图 3还可以可见, 在 PCB板的同一面上,在每一组贴装位 210内,连接太阳能晶片同一电 极的导带上设置有至少一个焊盘, 并且要保证在设置多个焊盘时,各 个焊点之间具有一定的间隔, 交错排列,这样做是为了在进行自动贴 装焊接时, 有效避免电极发生断路的现象。 As can be seen from FIG. 3, in the PCB design, in the mounting position 210, the widths of the conduction strips 231 and the pads 211 connecting the positive electrodes of the solar wafer are smaller than the positive electrode width of the solar wafer, and the negative electrodes of the solar wafer are connected. The width of the conduction band 232 and the pad 211 is smaller than the positive electrode width of the solar wafer, and this is for effectively avoiding a phenomenon in which the positive and negative electrodes are short-circuited during the automatic placement welding. For example, if the present invention employs a solar wafer of a structure and size having a positive electrode width of about 0.9 mm and a negative electrode width of about 0.23 mm, the width of the conduction band 231 connecting the positive electrode of the solar wafer may be within the mounting position. 0.3 to 0.4 mm, the width of the conduction band 232 connecting the negative electrode of the solar wafer can be For 0.1 ~ 0.29mm, the optimal choice is 0.2 mm. Moreover, in FIG. 3, it can be seen that, on the same side of the PCB board, in each set of mounting locations 210, at least one pad is disposed on the conductive strip connecting the same electrode of the solar wafer, and a plurality of soldering is ensured. In the case of the disk, each solder joint has a certain interval and is staggered. This is to avoid the phenomenon that the electrode is broken when performing automatic placement welding.
从以上结构描述可以看出,本发明的太阳能电池板可以采用小规 格的太阳能晶片,也就是说可以利用废弃太阳能晶片板进行切割后制 成小晶片, 再根据需要通过本发明的 PCB板设计方案进行组合制成 太阳能电池, 这样做可以有效地降低太阳能电池板的制作成本、减少 了资源的浪费。  It can be seen from the above structural description that the solar panel of the present invention can adopt a small-sized solar wafer, that is, it can be cut into small wafers by using a waste solar wafer board, and then the PCB board design of the present invention can be adopted as needed. The combination is made into a solar cell, which can effectively reduce the manufacturing cost of the solar panel and reduce the waste of resources.
本发明还提供了一种制备太阳能电池的制作方法,所述方法按照 以下过程进行:  The present invention also provides a method of fabricating a solar cell, the method being carried out according to the following process:
首先, 根据需求绘制电路制作 PCB板, 在 PCB板的一面上设置 至少一组太阳能晶片的贴装位, 用于自动贴装太阳能晶片,在每一组 贴装位上设置多个交错分布的焊点, 用于分别连接太阳能晶片的正、 负电极; 在上述 PCB板的同一面上还设置两组电极焊盘, 与太阳能 晶片正、 负电极相连的所有焊点通过导带分别连接两组电极焊盘, 其 中,一组电极焊盘作为电源的正极输出, 另一组电极焊盘作为电源的 负极输出。  First, draw a circuit to make a PCB board according to requirements, and install at least one set of mounting positions of the solar wafer on one side of the PCB board for automatically mounting the solar wafer, and set a plurality of staggered weldings on each set of mounting positions. Point, for connecting the positive and negative electrodes of the solar wafer respectively; two sets of electrode pads are disposed on the same side of the PCB board, and all the solder joints connected to the positive and negative electrodes of the solar wafer are respectively connected to the two sets of electrodes through the conduction band A pad, wherein one set of electrode pads serves as a positive output of the power source and the other set of electrode pads serves as a negative output of the power source.
这一过程中, 为了降低制造成本, 可以采用单面板布线设计, 选 择低成本的纸质 PCB板材或防火 PCB板材,根据 SMT的工艺特点, 板厚以 1.2mm ~ 1.6mm左右为宜,并且根据不同的使用要求,可以设 计不同的 PCB板版型。 在 PCB板上还需要设置至少两个定位孔(如 图 3至图 7中的定位孔 300 ), 主要是为了在自动贴片流程中进行精 确对位, 防止板滑动, 从而影响太阳能晶片的贴装效果。 In this process, in order to reduce the manufacturing cost, a single-panel wiring design can be adopted to select a low-cost paper PCB board or a fireproof PCB board. According to the process characteristics of SMT, the board thickness is preferably about 1.2 mm to 1.6 mm, and according to Different usage requirements can be set Different PCB board versions. At least two positioning holes (such as the positioning holes 300 in FIG. 3 to FIG. 7) need to be disposed on the PCB, mainly for accurately aligning in the automatic patching process, preventing the board from sliding, thereby affecting the sticking of the solar wafer. Install the effect.
然后, 在上述 PCB板上设置丝印指示定位线, 并在丝印中指明 贴片方向, 这样做是为了便于每个太阳能晶片在采用 SMT工艺时能 精确定位及避免贴反,而且还可以避免在大批量制造过程中电极开路 或短路现象的发生。  Then, a silk screen indicating positioning line is set on the above PCB board, and the patch direction is indicated in the silk screen, so that each solar chip can be accurately positioned and avoided by the SMT process, and the large offset can be avoided. Open or short circuit of the electrode during mass production.
其次, 将上述 PCB板定位, 并采用 SMT工艺在所述 PCB板上 贴装太阳能晶片, 制作太阳能电池板。 由于使用的太阳能晶片厚度仅 有 270 μ πι, 易碎、 易折断。 因此, 在进行上述 SMT生产工艺时还需 要注意以下几点:  Next, the above PCB board is positioned, and a solar wafer is mounted on the PCB by an SMT process to fabricate a solar panel. Since the solar wafer used is only 270 μm thick, it is fragile and fragile. Therefore, the following points should be noted when performing the above SMT production process:
1、 针对不同规格的太阳能晶片设计上料托盘或编带;  1. Design loading trays or braids for different specifications of solar wafers;
2、 针对不同规格的太阳能晶片设计专用的吸嘴及相适 的模具 夹具进行手工或自动贴片, 如吸嘴的头可以适当延长, 以适应长方形 太阳能晶片的需要, 并采用辅助定位夹具对太阳能晶片进行定位; 2. Manual or automatic placement of nozzles and suitable mold fixtures for different specifications of solar wafer design, such as nozzle heads can be extended to meet the needs of rectangular solar wafers, and auxiliary positioning fixtures for solar energy The wafer is positioned;
3、 为防止太阳能晶片在回流焊过程中发生位移, 要在贴片同时 采用红胶等对每个太阳能晶片进行预固定; 3. In order to prevent the solar wafer from being displaced during the reflow process, each solar wafer is pre-fixed with a red glue or the like at the same time as the patch;
4、 为防止 PCB板变形, 要合理设定回流焊炉的各温区炉温, 这 可以根据 SMT生产工艺要求导出, 属于现有技术的公知常识。  4. In order to prevent the deformation of the PCB board, it is necessary to reasonably set the furnace temperature of each temperature zone of the reflow oven, which can be derived according to the SMT production process requirements, and belongs to the common knowledge of the prior art.
综上所述, 在本发明的 PCB板的结构设计中, 需要根振对太阳 能晶片的精确测量, 精确设计焊盘线宽、 分布和间距, 并且在进行 SMT贴装工艺时还需要注意了上述几个关键点, 便可以有效地进行 太阳能电池板的大批量生产。应当理解的是,对本领域普通技术人员 来说,可以根据上述说明加以改进或变换, 而所有这些改进和变换都 应属于本发明所附权利要求的保护范围。 In summary, in the structural design of the PCB board of the present invention, it is necessary to accurately measure the solar wafer by the root vibration, accurately design the pad line width, distribution and spacing, and also pay attention to the above when performing the SMT mounting process. Several key points can be effectively carried out Mass production of solar panels. It is to be understood that those skilled in the art will be able to make modifications and changes in accordance with the above description, and all such modifications and variations are intended to fall within the scope of the appended claims.

Claims

权 利 要 求 Rights request
1、 一种太阳能电池板, 其特征在于, 在所述太阳能电池板的 PCB板的一面上,设置有至少一组太阳能晶片的贴装位,在每一组贴 装位上设置有多个交错分布的焊点, 用于分别连接太阳能晶片的正、 负电极; A solar panel, characterized in that, on one side of a PCB board of the solar panel, at least one set of mounting positions of solar chips is disposed, and a plurality of staggers are disposed on each set of mounting positions. Distributed solder joints for respectively connecting the positive and negative electrodes of the solar wafer;
在每一组贴装位上贴装有一太阳能晶片,每一个太阳能晶片构成 一单电池;  A solar wafer is attached to each set of mounting positions, and each solar wafer constitutes a single battery;
所述 PCB板的同一面上还设置有两个电极焊盘, 所有由太阳能 晶片构成的单电池通过导带串联或并联后分别连接两组电极焊盘,其 中,一组电极焊盘作为电源的正极输出, 另一组电极焊盘作为电源的 负才及 r出。  Two electrode pads are also disposed on the same surface of the PCB board, and all the cells composed of the solar wafers are connected in series or in parallel through the conduction bands, and then two sets of electrode pads are respectively connected, wherein one set of electrode pads is used as a power source. The positive output, the other set of electrode pads as the negative of the power supply and r out.
2、 根据权利要求 1所述的太阳能电池板, 其特征在于, 在所 述 PCB板的同一面上, 每一个太阳能晶片的两侧分别设置有一测试 点, 其中, 一个测试点通过导带连接所有与该太阳能晶片正电极相连 的焊盘,另一个测试点通过导带连接所有与该太阳能晶片的负电极相 连的焊盘。 2. The solar panel according to claim 1, wherein a test point is disposed on each side of each of the solar chips on the same side of the PCB, wherein one test point is connected by a conduction band. The pad connected to the positive electrode of the solar wafer, the other test point is connected to all the pads connected to the negative electrode of the solar wafer through a conduction band.
3、 根据权利要求 1所述的太阳能电池板, 其特征在于, 在每 一贴装位内, 连接太阳能晶片同一电极的导带上设置有至少一个焊 盘。 The solar cell panel according to claim 1, wherein at least one of the pads is disposed on the conduction band connecting the same electrode of the solar wafer in each of the mounting positions.
4、 根据权利要求 1所述的太阳能电池板, 其特征在于, 每一 个太阳能晶片为切割成长度是 30 ~ 40mm或 40 ~ 50mm的太阳能小晶 4. The solar panel according to claim 1, wherein each of the solar wafers is cut into solar crystals having a length of 30 to 40 mm or 40 to 50 mm.
U 片, 每一个太阳能小晶片至少有一组正负电极。 U Each of the solar small wafers has at least one set of positive and negative electrodes.
5、 根据权利要求 1所述的太阳能电池板, 其特征在于, 在所 述贴装位内,连接太阳能晶片正电极的导带及焊盘宽度小于太阳能晶 片的正电极宽度,连接太阳能晶片负电极的导带及焊盘宽度小于太阳 能晶片的负电极宽度。 ' The solar panel according to claim 1, wherein in the mounting position, the conduction band and the pad width connecting the positive electrode of the solar wafer are smaller than the positive electrode width of the solar wafer, and the negative electrode of the solar wafer is connected. The conduction band and pad width are smaller than the negative electrode width of the solar wafer. '
6、 根据权利要求 1所述的太阳能电池板, 其特征在于, 在所 述每个电极焊盘上设置有两个元件通孔,用于通过跳线将电极引向所 述 PCB板的另一面。 The solar panel according to claim 1, wherein two element through holes are provided on each of the electrode pads for guiding the electrodes to the other side of the PCB through jumpers .
7、 根据权利要求 1所述的太阳能电池板, 其特征在于, 所述 PCB板上设置有至少两个定位孔, 用于自动贴片流程中进行精确对 位0 7, the solar cell panel according to claim 1, characterized in that, on the PCB is provided with at least two positioning holes for automatic placement process for precise alignment 0
8、 一种太阳能电池板的制作方法, 其特征在于, 所述方法按 照以下步據进行: 8. A method of fabricating a solar panel, characterized in that the method is carried out according to the following steps:
A、 根据需求绘制电路制作 PCB板, 在 PCB板的一面上设置至 少一組太阳能晶片的贴装位,在每一組贴装位上设置多个交错分布的 焊盘, 用于分别连接太阳能晶片的正、 负电极; 在所述 PCB板的同 一面上还设置两組电极焊盘, 与太阳能晶片正、 负电极相连的所有焊 盘通过导带分别连接两组电极焊盘,其中, 一组电极坪盘作为电源的 正极输出, 另一组电极焊盘作为电源的负极输出;  A. Draw a circuit to prepare a PCB board according to requirements, set at least one set of mounting positions of the solar chips on one side of the PCB board, and set a plurality of staggered pads on each set of mounting positions for respectively connecting the solar chips Positive and negative electrodes; two sets of electrode pads are disposed on the same side of the PCB, and all the pads connected to the positive and negative electrodes of the solar chip are respectively connected to the two sets of electrode pads through the conduction band, wherein, one set The electrode plate is used as the positive output of the power source, and the other electrode pad is used as the negative output of the power source;
B、在所述 PCB板上设置丝印指示定位线,并在丝印中指明贴片 方向;  B. setting a silk screen on the PCB to indicate a positioning line, and indicating a patch direction in the silk screen;
42 C、将所述 PCB板定位, 并采用 SMT工艺在所述 PCB板上贴装 太阳能晶片, 制作太阳能电池板。 42 C. Positioning the PCB board, and mounting a solar wafer on the PCB board by using an SMT process to fabricate a solar panel.
9、 根据权利要求 8所述的方法,其特征在于,所述步驟 C中, 采用粘合剂对每一个太阳能晶片进行预固定。 9. The method of claim 8 wherein in step C, each solar wafer is pre-fixed with an adhesive.
10、 根据权利要求 8所述的方法,其特征在于,所述步骤 C中, 采用辅助定位夹具对太阳能晶片进行定位。 10. The method of claim 8 wherein in step C, the solar wafer is positioned using an auxiliary positioning fixture.
PCT/CN2008/000534 2007-12-26 2008-03-18 Solar cell board and fabricating method thereof WO2009082868A1 (en)

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